Thermalright TF9 Thermal Paste 13 W/mK 1.5g
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15,000IQD
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Thermal paste from Thermalright. The Thermalright TF9 Thermal Paste 13 W/mK 1.5g provides high-efficiency heat transfer between processor surfaces and heatsinks. Featuring 13 W/mK thermal conductivity and a non-conductive gray formula, this 1.5g syringe ensures safe, reliable cooling performance across demanding hardware setups.
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Specifications
Thermal Conductivity (W/mK)13 W/mK
Component BrandThermalright
ColorGray
Details
• Model : Thermalright TF9 Thermal Paste – 1.5g • Type : High-performance thermal compound • Net Weight : 1.5 grams • Thermal Conductivity : 12.8 W/m·K • Thermal Resistance : <0.0018 °C·in²/W • Viscosity : 250 poise • Density : 2.6 g/cm³ • Color : Gray • Operating Temperature : -220 °C to +380 °C • Electrically Conductive : No (non-conductive, safe for electronic components) • Application : CPU, GPU, and other high-performance chipsets • Packaging : Syringe-type applicator for easy use • Features : – High thermal conductivity for efficient heat transfer – Stable performance under extreme conditions – Long-lasting durability without drying or cracking – Safe for use with all heatsinks and cooling solutions
Thermal Conductivity (W/mK)13 W/mK
Component BrandThermalright
ColorGray