Thermaltake TG-30 Premium Thermal Compound 4g
By ThermaltakeThe Thermaltake TG-30 is a high-performance, non-electrically conductive thermal compound featuring diamond powder for efficient heat transfer. It includes a convenient application kit with a stencil and spatula for a perfect, mess-free spread.
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Specifications
Details
The Thermaltake TG-30 Premium Thermal Compound is engineered to provide high-standard cooling performance for both CPU and GPU components. Formulated with diamond powder, it delivers a reliable thermal conductivity of 4.5 W/m-k, ensuring your system operates at peak performance under various workloads. This thermal paste is non-electrically conductive, providing safety for sensitive electronic components while minimizing the risk of short circuits. Designed for longevity, the compound resists drying out and cracking over time, maintaining its consistency for years. The included application kit features a unique honeycomb stencil and a precision spatula to ensure a neat, even layer across the entire integrated heat spreader. By optimizing contact between the processor and the cooling solution, it helps significantly lower system temperatures. Whether you are building a new PC or performing routine maintenance, the TG-30 is a reliable choice for efficient thermal management.
Specifications
- Thermal Conductivity: 4.5 W/m-K
- Weight: 4g
- Viscosity: 76 Pa-s
- Density: 2.55 g/cm³
- Thermal Impedance: 0.185°C-in²/W
- Application: CPU, GPU, Chipset
- Includes: Honeycomb Stencil, Spatula, Alcohol Wipes